| Item | 2022 | 2023 | 2024 | ||
| Layer Count | 38 | 40 | 42 | ||
| Max. Board Size | 1067x610mm [42x24"] | 1092x660mm [43x26"] | 1092x660mm [43x26"] | ||
| Max. Board Thickness | 6.5mm | 8mm | 10mm | ||
| Min. Board Thickness | 0.30mm | 0.25mm | 0.20mm | ||
| Min. Core Thickness (No include Cu) | 0.05mm | 0.05mm | 0.038mm | ||
| Min. Dielectric Thickness | 0.064mm | 0.064mm | 0.038mm | ||
| Max. Final Copper Thickness | Inner layer | 10OZ | 12OZ | 12OZ | |
| Outer layer | 10OZ | 12OZ | 12OZ | ||
| Outer Layer Min. Trace Width/Space (1/3oz starting foil +plating) | 0.09/0.09mm | 0.06/0.06mm | 0.06/0.06mm | ||
| Inner Layer Min. Trace Width/Space (Hoz starting foil +plating) | 0.076/0.076mm | 0.05/0.05mm | 0.05/0.05mm | ||
| Min. Mechanical Drill Size | 0.20mm | 0.20mm | 0.15mm | ||
| Min. Laser Drill Size | 0.10mm | 0.10mm | 0.08mm | ||
| Min. Distance between Hole Edge to Hole Edge(Different Net) | 0.23mm | 0.23mm | 0.23mm | ||
| Min. Pad Size Over Drill | 0.46mm | 0.46mm | 0.40mm | ||
| Aspect Ratio | 10:1 | 10:1 | 25:1 | ||
| Impedance Control Tolerance | ±10% | ±8% | ±5% | ||
| Copper Feature to Edge, V-cut (30°) | 0.40mm | 0.40mm | 0.36mm | ||
| Copper Feature toPCBEdge,Routed | 0.25mm | 0.25mm | 0.20mm | ||
| Tolerance on Overall Dimensions | ±0.10mm | ±0.10mm | ±0.05mm | ||
| Surface Finishing | Immersion Gold (ENIG),FlashGold, HASL, Lead Free HASL, OSP, Immersion Tin, Immersion Silver, ENEPIG,Gold Fingers,Tinned Copper, Plated Soft Gold,Wire Bondable Gold, Selective and Multiple Surface Finishing, Carbon Ink, Peelable SM. | ||||
| Materials | FR4 | Normal Tg | Shengyi, ITEQ, KB, Nanya | ||
| Mid Tg (Lead Free Compatible) | Shengyi S1000/S1000H, ITEQ IT158, KB-6165 | ||||
| High Tg (Lead Free Compatible) | Shengyi S1000-2/S1000-2M, Isola 370HR, ITEQ IT180A, EMC EM827, Panasonic R1755V | ||||
| High Performance Low Loss FR4 | Isola FR408, Isola FR408HR, Isola I-Speed, I-Tera MT, EMC EM828, EM888(S), EM888(K), Nelco N4000-13EP, EPSI, Panasonic R5775 Megtron 6 | ||||
| RF Materials | Rogers RO4350B, RO4003C, Taconic RF-30, RF-35, TLC, TLX, TLY, Taconic 601, 602, 603, 605 | ||||
| Halogen Free | EMC EM285, EM370(D), Panasonic R1566 | ||||
| Aluminum Backed PCB | Shengyi SAR20, Bergquist, Yugu YGA | ||||
| Additional Materials | Rigid Polyimide: Shengyi SH260, Ventec VT901 BT Epoxy: Nelco and Mitsubishi High CTI FR4: Shengyi S1600 Flexible PCB materials: Dupont, Panasonic, Taiflex, Shengyi | ||||
| HDI Ability | Protype | 3+N+3 | 5+N+5 | anylayer | |
| Mass Production | 3+N+3 | 5+N+5 | anylayer | ||
| Rigid-Flexbile Board Layer | 10R+12F+10R | 10R+16F+10R | 10R+16F+10R | ||
| High Conductivity PCB | Mass Production | Mass Production | Mass Production | ||
| Heat sink PCB | Mass Production | Mass Production | Mass Production | ||
| Embedded Capacitance/Resistance PCB | Mass Production | Mass Production | Mass Production | ||
| High Frequency High Speed PCB | Mass Production | Mass Production | Mass Production | ||
| Plated Gold on Step Part Area (Include Gold Finger) | Mass Production | Mass Production | Mass Production | ||
| Second Step PCB | Mass Production | Mass Production | Mass Production | ||
| Embedded Core PCB | Mass Production | Mass Production | Mass Production | ||
| Cavity PCB | Mass Production | Mass Production | Mass Production | ||
| Aluminum PCB | Mass Production | Mass Production | Mass Production | ||
Advanced Processes | ||||
| Direct Imaging for Innerlayers, Outerlayers, and Soldermask | ||||
| Direct Plating for High Layer Count and Microvias PCBs | ||||
| Reverse Pulse Plating | ||||
| Solid Copper Plating PTH Vias | ||||
| XACT Tooling System for Improved Layer-to-layer Registration | ||||
| Spray Coating for Soldermask | ||||
| Inkjet Printing for Legend | ||||
| In-Line AOI for Outerlayers and AOI FOR Final Insepection | ||||
| ORMET® Copper Paste for Any-layer Connections | ||||
| ZETA® Materials for HDI and Low-Loss Applications | ||||
| AVI Testing |